ZHCSMQ6B October   2020  – May 2021 SN74HCS138

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
    1.     4
    2.     5
  4. Revision History
  5. Pin Configuration and Functions
    1.     8
    2.     9
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

器件信息
器件型号 封装(1) 封装尺寸(标称值)
SN74HCS138PW TSSOP (16) 5.00mm × 4.40mm
SN74HCS138D SOIC (16) 9.90mm × 3.90mm
SN74HCS138BQB WQFN (16) 3.50mm × 2.50mm
SN74HCS138DYY SOT-23-THN (16) 4.20mm × 2.00mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。