ZHCSLY3B August   2020  – December 2021 SN74HCS164

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
    1.     4
      1.      5
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

Pin Configuration and Functions

GUID-DED66B87-B175-4643-96BA-301B9E2E71AB-low.gifD, PW or DYY Package
16-Pin SOIC, TSSOP or SOT-23-THIN
Top View
GUID-20201111-CA0I-ZGTX-DLMP-CGLC7R64RFDH-low.gifBQA Package
16-Pin WQFN
Top View
PIN I/O DESCRIPTION
SOIC, TSSOP or SOT-23-THIN NO. NAME
1 A I Serial input A
2 B I Serial input B
3 QA O Parallel output A
4 QB O Parallel output B
5 QC O Parallel output C
6 QD O Parallel output D
7 GND Ground
8 CLK I Clock, rising edge triggered
9 CLR I Clear 1 Active-Low
10 QE O Parallel output E
11 QF O Parallel output F
12 QG O Parallel output G
13 QH O Parallel output H
14 VCC Positive supply
Thermal Pad(1) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
BQA Package only.