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ZHCSP25 October 2021 SN74HCS574

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HCS574	UNIT
		RKS (VQFN)
		20 PINS
R_θJA	Junction-to-ambient thermal resistance	83.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	82.6	°C/W
R_θJB	Junction-to-board thermal resistance	57.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	14.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	56.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	40.0	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.