米6体育平台手机版

ZHCSPO8G November 1988 – October 2022 SN74HCT02

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC		14 PINS	14 PINS	14 PINS	14 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	138.7	67	93.3	120.1	°C/W
R_{θJC (top)}	Junction-to-case (top) thermal resistance	93.8	55	50.9	49.4	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	46.7	53.8	63.1	°C/W
Ψ_JT	Junction-to-top characterization parameter	49.1	35.1	17.8	6.7	°C/W
Ψ_JB	Junction-to-board characterization parameter	94.3	46.5	53.3	62.5	°C/W
R_{θJC (bot)}	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.