米6体育平台手机版

ZHCSPT3F July 1986 – October 2022 SN54HCT04 , SN74HCT04

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC		14 PINS	14 PINS	14 PINS	14 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	138.7	62.7	90.9	117.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	93.8	50.5	48.5	46.9	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	42.5	51.5	60.6	°C/W
ψ_JT	Junction-to-top characterization parameter	49.1	30.1	15.9	5.6	°C/W
ψ_JB	Junction-to-case (bottom) thermal resistance	94.3	42.2	51	60	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.