ZHCSPV2G November 1988 – October 2022 SN74HCT125
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC | D (SOIC) | N (PDIP) | UNIT | |
|---|---|---|---|---|
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 138.7 | 75.3 | °C/W |
| RθJC | Junction-to-case (top) thermal resistance | 93.8 | 68.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 94.7 | 55.1 | °C/W |
| ψJT | Junction-to-top characterization paramete | 49.1 | 41.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 94.3 | 54.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |