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SCLS225G JULY 1995 – November 2016 SN54HCT14 , SN74HCT14

PRODUCTION DATA.

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

D|14
PW|14
DB|14
DGV|14
N|14

散热焊盘机械数据 (封装 | 引脚)

订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
Supply voltage, V_CC		–0.5	7	V
Input voltage, V_I⁽²⁾		–0.5	V_CC + 0.5	V
Output voltage, V_O⁽²⁾		–0.5	V_CC + 0.5	V
Input clamp current, I_IK	V_I < 0 or V_I > V_CC		±20	mA
Output clamp current, I_OK	V_O < 0 or V_O > V_CC		±20	mA
Continuous output current, I_O	V_O = 0 to V_CC		±25	mA
Continuous current through V_CC or GND			±50	mA
Operating junction temperature, T_J			150	°C
Storage temperature, T_stg		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

see⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		4.5	5.5	V
V_I	Input voltage		0	V_CC	V
V_O	Output voltage		0	V_CC	V
T_A	Operating free-air temperature	SN54HCT14	–55	125	°C
T_A	Operating free-air temperature	SN74HCT14	–40	85	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HCT14					UNIT
		D (SOIC)	DB (SSOP)	DGV (TVSOP)	N (PDIP)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	90.9	105	132.2	55.3	120.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51	57	51.7	42.5	48.9	°C/W
R_θJB	Junction-to-board thermal resistance	45.2	52.4	61.4	35.1	61.9	°C/W
ψ_JT	Junction-to-top characterization parameter	18.4	22.2	5.5	27.2	5.7	°C/W
ψ_JB	Junction-to-board characterization parameter	44.9	51.8	60.7	35	61.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		MIN	TYP	MAX	UNIT
V_T+	Positive-going threshold	V_CC = 4.5 V	T_A = 25°C	1.2	1.5	1.9	V
			SN54HCT14	1.2		1.9
			SN74HCT14	1.2		1.9
		V_CC = 5.5 V	T_A = 25°C	1.4	1.7	2.1
			SN54HCT14	1.4		2.1
			SN74HCT14	1.4		2.1
V_T–	Negative-going threshold	V_CC = 4.5 V	T_A = 25°C	0.5	0.9	1.2	V
			SN54HCT14	0.5		1.2
			SN74HCT14	0.5		1.2
		V_CC = 5.5 V	T_A = 25°C	0.6	1	1.4
			SN54HCT14	0.6		1.4
			SN74HCT14	0.6		1.4
ΔV_T	Hysteresis (V_T+ – V_T–)	V_CC = 4.5 V	T_A = 25°C	0.4	0.6	1.4	V
			SN54HCT14	0.4		1.4
			SN74HCT14	0.4		1.4
		V_CC = 5.5 V	T_A = 25°C	0.4	0.65	1.5
			SN54HCT14	0.4		1.5
			SN74HCT14	0.4		1.5
V_OH	High-level output voltage	I_OH = –20 µA and V_CC = 4.5 V	T_A = 25°C	4.4	4.49		V
			SN54HCT14	4.4
			SN74HCT14	4.4
		I_OH = –4 mA and V_CC = 4.5 V	T_A = 25°C	3.98	4.3
			SN54HCT14	3.7
			SN74HCT14	3.84
V_OL	Low-level output voltage	I_OL = 20 µA and V_CC = 4.5 V	T_A = 25°C		0.001	0.1	V
			SN54HCT14			0.1
			SN74HCT14			0.1
		I_OL = 4 mA and V_CC = 4.5 V	T_A = 25°C		0.17	0.26
			SN54HCT14			0.4
			SN74HCT14			0.33
I_I	Input current	V_I = V_CC or GND and V_CC = 5.5 V	T_A = 25°C			±0.1	µA
			SN54HCT14			±1
			SN74HCT14			±1
I_CC	Supply current	V_I = V_CC or GND, I_O = 0, and V_CC = 5.5 V	T_A = 25°C			2	µA
			SN54HCT14			40
			SN74HCT14			20
ΔI_CC⁽¹⁾	Change in supply current	One input at 0.5 V or 2.4 V, other inputs at GND or V_CC, and V_CC = 5.5 V	T_A = 25°C		0.2	2.4	mA
			SN54HCT14			3
			SN74HCT14			2.9
C_i	Input capacitance	V_I = V_CC or GND and V_CC = 5 V	T_A = 25°C		3	10	pF
			SN54HCT14			10
			SN74HCT14			10

(1) This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V_CC.

6.6 Switching Characteristics

over recommended operating free-air temperature range and C_L = 50 pF (unless otherwise noted; see Figure 5)

PARAMETER		FROM (INPUT)	TO (OUTPUT)	TEST CONDITIONS		TYP	MAX	UNIT
t_pd	Propagation (delay) time	A	Y	V_CC = 4.5 V	T_A = 25°C	20	32	ns
					SN54HCT14		48
					SN74HCT14		40
				V_CC = 5.5 V	T_A = 25°C	18	30
					SN54HCT14		45
					SN74HCT14		38
t_t		—	Y	V_CC = 4.5 V	T_A = 25°C	7	15	ns
					SN54HCT14		22
					SN74HCT14		19
				V_CC = 5.5 V	T_A = 25°C	6	14
					SN54HCT14		20
					SN74HCT14		17

6.7 Operating Characteristics

T_A = 25°C

PARAMETER		TEST CONDITIONS	TYP	UNIT
C_pd	Power dissipation capacitance	No load	10	pF

6.8 Typical Characteristics

Figure 1. Supply Current vs Input Voltage

Figure 3. Output Voltage vs Input Voltage

Figure 2. Supply Current vs Input Voltage

Figure 4. Output Voltage vs Input Voltage