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ZHCSPW4C June 2003 – June 2022 SN74HCT244-Q1

PRODUCTION DATA

5.3 Thermal Information

THERMAL METRIC		PW (TSSOP)	UNIT
THERMAL METRIC		20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	131.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	72.2	°C/W
R_θJB	Junction-to-board thermal resistance	82.8	°C/W
ψ_JT	Junction-to-top characterization parameter	21.5	°C/W
ψ_JB	Junction-to-board characterization parameter	82.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.