ZHCSQK3H march 2003 – august 2023 SN54HCT244 , SN74HCT244
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC | SN74HCT244 | UNIT | ||||||
|---|---|---|---|---|---|---|---|---|
| DW (SOIC) | DB (SSOP) | N (PDIP) | NS (SO) | PW (TSSOP) | DGS (VSSOP) | |||
| 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 122.7 | 84.6 | 113.4 | 131.8 | 130.6 | °C/W |
| RθJC (top) | Junction-to-case (top) thermal resistance | 76 | 81.6 | 72.5 | 78.6 | 72.2 | 68.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | 77.5 | 65.3 | 78.4 | 82.8 | 85.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 51.5 | 46.1 | 55.3 | 47.1 | 21.5 | 10.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 77.1 | 77.1 | 65.2 | 78.1 | 82.4 | 85.0 | °C/W |
| RθJC (bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | N/A | °C/W |