米6体育平台手机版

ZHCSPU1G November 1988 – October 2022 SN74HCT32

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	138.7	114.8	67	93.3	159.8	°C/W
R_{θJC (top)}	Junction-to-case (top) thermal resistance	93.8	60	55	50.9	92.7	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	63.8	46.7	53.8	102.1	°C/W
Ψ_JT	Junction-to-top characterization parameter	49.1	19.7	35.1	17.8	40.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	94.3	63.1	46.5	53.3	101.7	°C/W
R_{θJC (bot)}	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.