ZHCSRJ1A january 2023 – august 2023 SN74LV165B-EP
PRODUCTION DATA
THERMAL METRIC(1) | SN74LV165B-EP | UNIT | |
---|---|---|---|
PW (TSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 131.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 69.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 75.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 21.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 75.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |