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ZHCSWI4M May 1999 – September 2024 SN74LV4053A

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information: SN74LV4053A

THERMAL METRIC ⁽¹⁾		SN74LV4053A				UNIT
		D (SOIC)	PW (TSSOP)	RGY (VQFN)	DYY (SOT)
		16 PINS	16 PINS	16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	115.2	140.2	89.4	199.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	75.0	72.6	89.7	121.2	°C/W
R_θJB	Junction-to-board thermal resistance	76.6	98.7	65.4	129.0	°C/W
Ψ_JT	Junction-to-top characterization parameter	31.3	13.4	25.0	24.6	°C/W
Ψ_JB	Junction-to-board characterization parameter	75.7	97.3	65.2	126.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	48.9	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.