ZHCSUV0J April   1999  – February 2024 SN74LV4066A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information: SN74LV4066A
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics (LV)
    6. 5.6 Timing Characteristics VCC = 2.5V ± 0.2V
    7. 5.7 Timing Characteristics VCC = 3.3V ± 0.3V
    8. 5.8 Timing Characteristics VCC = 5V ± 0.5V
    9. 5.9 AC Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • RGY|14
  • DGV|14
  • DB|14
  • PW|14
  • N|14
  • NS|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information: SN74LV4066A

THERMAL METRIC(1) SN74LV4066A  UNIT
D (SOIC) PW (TSSOP) RGY (VQFN)
14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance  128.8 150.6 91.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 81.8 78.2 91.8 °C/W
RθJB Junction-to-board thermal resistance 84.2 93.7 66.5 °C/W
ΨJT Junction-to-top characterization parameter 39.5 24.6 20.0 °C/W
ΨJB Junction-to-board characterization parameter 83.7 93.1 66.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 50.0 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.