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SCLS589B August 2004 – May 2020 SN74LV8154

PRODUCTION DATA.

1 Features
2 Applications
3 Description
1. Device Images
  1. Simplified Schematic
4 Revision History
5 Pin Configuration and Functions
1. Table 1. Pin Functions
6 Specifications
7 Parameter Measurement Information
8 Detailed Description
9 Application and Implementation
1. 9.1 Application Information
2. 9.2 Typical Application
10Power Supply Recommendations
11Layout
1. 11.1 Layout Guidelines
2. 11.2 Layout Example
12Device and Documentation Support
13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

N|20
PW|20

散热焊盘机械数据 (封装 | 引脚)

订购信息

scls589b_oa
scls589b_pm

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74LV8154N	SN74LV8154PW	UNIT
		N (PDIP)	PW (TSSOP)
		20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	54.9	100.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	46.5	30.9	°C/W
R_θJB	Junction-to-board thermal resistance	35.9	47.1	°C/W
ψ_JT	Junction-to-top characterization parameter	23.5	1.5	°C/W
ψ_JB	Junction-to-board characterization parameter	35.7	46.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).