SCAS289M January   1993  – December 2014 SN74LVC112A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements, -40°C to 85°C
    7. 7.7  Timing Requirements, -40°C to 125°C
    8. 7.8  Switching Characteristics, -40°C to 85°C
    9. 7.9  Switching Characteristics, -40°C to 125°C
    10. 7.10 Operating Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • DB|16
  • NS|16
  • D|16
  • DGV|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VI Input voltage range(2) –0.5 6.5 V
VO Output voltage range(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature range 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 3000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage Operating 1.65 3.6 V
Data retention only 1.5
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 2.7 V to 3.6 V 2
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 2.7 V to 3.6 V 0.8
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 2.7 V –12
VCC = 3 V –24
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 2.7 V 12
VCC = 3 V 24
Δt/Δv Input transition rise or fall rate 10 ns/V
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

7.4 Thermal Information

THERMAL METRIC(1) SN74LVC112A UNIT
D DB DGV NS PW
24 PINS
RθJA Junction-to-ambient thermal resistance 90.6 107.1 129.0 90.7 122.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.9 59.6 52.1 48.3 51.4
RθJB Junction-to-board thermal resistance 44.8 54.4 62.0 49.4 64.4
ψJT Junction-to-top characterization parameter 14.7 20.5 6.5 14.6 6.7
ψJB Junction-to-board characterization parameter 44.5 53.8 61.3 49.1 63.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C –40°C to 85°C –40°C to 125°C UNIT
MIN TYP(1) MAX MIN MAX MIN MAX
VOH IOH = –100 μA 1.65 V to
3.6 V		 VCC – 0.2 VCC – 0.2 VCC – 0.2 V
IOH = –4 mA 1.65 V 1.2 1.2 1.2
IOH = –8 mA 2.3 V 1.7 1.7 1.7
IOH = –12 mA 2.7 V 2.2 2.2 2.2
3 V 2.4 2.4 2.4
IOH = –24 mA 3 V 2.2 2.2 2.2
VOL IOL = 100 μA 1.65 V to
3.6 V		 0.2 0.2 0.2 V
IOL = 4 mA 1.65 V 0.45 0.45 0.45
IOL = 8 mA 2.3 V 0.7 0.7 0.7
IOL = 12 mA 2.7 V 0.4 0.4 0.4
IOL = 24 mA 3 V 0.55 0.55 0.55
II VI = 5.5 V or GND 3.6 V ±5 ±5 ±5 μA
ICC VI = VCC or GND, IO = 0 3.6 V 10 10 10 μA
ΔICC One input at VCC – 0.6 V,
Other inputs at VCC or GND		 2.7 V to
3.6 V		 500 500 500 μA
Ci VI = VCC or GND 3.3 V 4.5 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.

7.6 Timing Requirements, –40°C to 85°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V
± 0.3 V		 UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
fclock Clock frequency 120 150 150 150 MHz
tw Pulse duration, CLK high or low 4.2 3.3 3.3 3.3 ns
tsu Setup time Data before CLK↓ 5.8 3.2 3.1 2.3 ns
PRE or CLR inactive 5 2.8 2.4 1.1
th Hold time, data after CLK↓ 6.2 4.4 2.5 0.7 ns

7.7 Timing Requirements, –40°C to 125°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V
± 0.3 V		 UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
fclock Clock frequency 120 150 150 150 MHz
tw Pulse duration, CLK high or low 4.1 3.3 3.3 3.3 ns
tsu Setup time Data before CLK↓ 6 3.2 3.1 2.3 ns
PRE or CLR inactive 5 2.8 2.4 1.1
th Hold time, data after CLK↓ 6.2 4.7 2.5 0.7 ns

7.8 Switching Characteristics, –40°C to 85°C

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT
MIN MAX MIN MAX MIN MAX MIN TYP MAX
fmax 150 150 150 150 MHz
tpd CLR or PRE Q or Q 5.9 4.1 5.5 1 3.4 4.8 ns
CLK 5.6 4 7.1 1 3.5 5.9

7.9 Switching Characteristics, –40°C to 125°C

over operating free-air temperature range (unless otherwise noted)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT
MIN MAX MIN MAX MIN MAX MIN TYP MAX
fmax 120 150 150 150 MHz
tpd CLR or PRE Q or Q 6.2 4 6 1 3.4 5.3 ns
CLK 6.2 4.1 7.6 1 3.5 6.4

7.10 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V UNIT
TYP TYP TYP
Cpd Power dissipation capacitance f = 10 MHz  See(1) See(1) 24 pF
(1) This information was not available at the time of publication.

7.11 Typical Characteristics

D001_SCAS289.gifFigure 1. TPD vs Temperature
D002_SCAS289.gifFigure 2. TPD vs VCC at 25°C
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |