SCES469F August   2003  – March 2020 SN74LVC1404

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics, CL = 15 pF
    7. 7.7 Switching Characteristics, CL = 30 pF or 50 pF
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Testing
      3. 10.2.3 Application Curves
        1. 10.2.3.1 LVC1404 in 25-MHz Crystal-Oscillator Circuit
        2. 10.2.3.2 LVC1404 in 10-MHz Crystal-Oscillator Circuit
        3. 10.2.3.3 LVC1404 in 2-MHz Crystal-Oscillator Circuit
        4. 10.2.3.4 LVC1404 in 100-kHz Crystal-Oscillator Circuit
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • YZP|8
  • DCT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) DCT DCU YZP UNIT
8 PINS 8 PINS 8 BALLS
RθJA Junction-to-ambient thermal resistance 184.8 198.4 97.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 115.3 73.5 1.1
RθJB Junction-to-board thermal resistance 97.3 77.1 26.3
ψJT Junction-to-top characterization parameter 40.9 6.1 0.5
ψJB Junction-to-board characterization parameter 96.3 76.7 26.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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