3 Pin Configuration and Functions

Figure 3-1 SN54LVC157A J or W Package, 16-Pin CDIP or CFP; SN74LVC157A D, DB, NS, or, PW Package, 16-Pin SOIC, SSOP, SOP, or TSSOP (Top View)

Figure 3-3 SN54LVC157A FK Package, 16-Pin LCCC (Top View)

Figure 3-2 SN74LVC157A BQB or RGY Package, 16-Pin WQFN or VQFN (Top View)

Table 3-1 Pin Functions

PIN		TYPE⁽¹⁾	DESCRIPTION
NAME	NO.	TYPE⁽¹⁾	DESCRIPTION
A/B	1	I	Address select
1A	2	I	Channel 1, data input A
1B	3	I	Channel 1, data input B
1Y	4	O	Channel 1, data output
2A	5	I	Channel 2, data input A
2B	6	I	Channel 2, data input B
2Y	7	O	Channel 2, data output
GND	8	G	Ground
3Y	9	O	Channel 3, data output
3B	10	I	Channel 3, data input B
3A	11	I	Channel 3, data input A
4Y	12	O	Channel 4, data output
4B	13	I	Channel 4, data input B
4A	14	I	Channel 4, data input A
G	15	I	Output strobe, active low
V_CC	16	P	Positive supply
Thermal pad⁽²⁾		—	The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.

(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.

(2) WBQB package only.