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ZHCSJV3G March 2004 – June 2019 SN74LVC1G08-Q1

PRODUCTION DATA.

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THERMAL METRIC⁽¹⁾		SN74LVC1G08-Q1			UNIT
		DBV	DCK	DRY
		5 PINS	5 PINS	6 PINS
R_θJA	Junction-to-ambient thermal resistance	209.4	244.2	264.4	°C/W
R_θJCtop	Junction-to-case (top) thermal resistance	132.5	156.1	166.6	°C/W
R_θJB	Junction-to-board thermal resistance	118.1	130.8	142.2	°C/W
ψ_JT	Junction-to-top characterization parameter	48.8	47.2	26.1	°C/W
ψ_JB	Junction-to-board characterization parameter	117.4	130.0	141.6	°C/W
R_θJCbot	Junction-to-case (bottom) thermal resistance	–	–	–	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.