SCES487I September 2003 – November 2024 SN74LVC1G11
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information
- 5.5 Electrical Characteristics
- 5.6 Switching Characteristics, CL = 15 pF
- 5.7 Switching Characteristics, CL = 30 pF or 50 pF
- 5.8 Switching Characteristics, CL = 30 pF or 50 pF
- 5.9 Operating Characteristics
- 5.10 Typical Characteristics
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DBV|6
- DSF|6
- YZP|6
- DCK|6
- DRY|6
散热焊盘机械数据 (封装 | 引脚)
- DRY|6
订购信息
9.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |