SCES487I September   2003  – November 2024 SN74LVC1G11

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, CL = 15 pF
    7. 5.7  Switching Characteristics, CL = 30 pF or 50 pF
    8. 5.8  Switching Characteristics, CL = 30 pF or 50 pF
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|6
  • DSF|6
  • YZP|6
  • DCK|6
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G11UNIT
DBV (SOT-23)DCK (SC70)DRY (SON)YZP (DSBGA)DSF (SON)
6 PINS6 PINS6 PINS6 PINS6 PINS
RθJAJunction-to-ambient thermal resistance195.9260.1424.6105.8413.7°C/W
RθJCtopJunction-to-case (top) thermal resistance177.498.13091.6226.6°C/W
RθJBJunction-to-board thermal resistance51.763.129210.8317°C/W
ψJTJunction-to-top characterization parameter61.32.2135.43.137.4°C/W
ψJBJunction-to-board characterization parameter51.362.429210.8317°C/W
RθJCbotJunction-to-case (bottom) thermal resistance—————°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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