SCES487I September 2003 – November 2024 SN74LVC1G11
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information
- 5.5 Electrical Characteristics
- 5.6 Switching Characteristics, CL = 15 pF
- 5.7 Switching Characteristics, CL = 30 pF or 50 pF
- 5.8 Switching Characteristics, CL = 30 pF or 50 pF
- 5.9 Operating Characteristics
- 5.10 Typical Characteristics
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DBV|6
- DSF|6
- YZP|6
- DCK|6
- DRY|6
散热焊盘机械数据 (封装 | 引脚)
- DRY|6
订购信息
3 Description
The SN74LVC1G11 performs the Boolean
function 
in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Device Information
| PART NUMBER | PACKAGE(1) | BODY SIZE(2) |
|---|---|---|
| SN74LVC1G11 | DBV (SOT-23, 6) | 2.90 mm × 1.60 mm |
| DCK (SC70, 6) | 2.00 mm × 1.25 mm | |
| DRY (SON, 6) | 1.45 mm × 1.00 mm | |
| DSF (SON, 6) | 1.00 mm × 1.00 mm | |
| YZP (DSBGA, 6) | 1.41 mm × 0.91 mm |
(1) For more information, see Mechanical, Packaging, and Orderable
Information.
(2) The body size (length × width) is a nominal value and does not include pins.
Logic Diagram (Positive Logic)