4 Revision History
Changes from C Revision (December 2013) to D Revision
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Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
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Deleted YEP, YZP packages throughout data sheetGo
Changes from B Revision (September 2006) to C Revision
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Updated document to new TI data sheet format.Go
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Removed Ordering Information tableGo
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Updated operating temperature range.Go
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Added ESD warning.Go