ZHCSDC2C February   2015  – August 2021 SN74LVC1G14-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, CL = 15 pF
    7. 6.7 Switching Characteristics, CL = 30 pF or 50 pF
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCK|5
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision B (August 2019) to Revision C (August 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated the pin numbers for VCC and N.C. in the Pin Functions table for the DRY package to match the pin configurationGo
  • Updated the TPD Across Temperature at 3.3 V VCC image in the Typical Characteristics Go

Changes from Revision A (March 2017) to Revision B (August 2019)

  • 器件信息 表添加了 SON (6) DRY 封装Go
  • Added DRY package pinout to Pin Configurations and Functions section Go

Changes from Revision * (February 2015) to Revision A (March 2017)

  • 器件信息 表中的封装类型更改为 DCK (SC70) 并更正了封装尺寸Go
  • Deleted θJA from Absolute Maximum Ratings tableGo