SCES663C March   2006  – January 2020 SN74LVC1G17-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics—DC Limit Changes
    6. 6.6 Switching Characteristics AC Limit
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DCK|5
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (October 2019) to C Revision

  • Corrected clerical errors introduced in Revision B: Features included incorrect valuesGo
  • Changed to automotive ESD table format Go
  • Corrected clerical errors introduced in Revision B: Electrical Characteristics values returned to Revision A valuesGo
  • Corrected clerical errors introduced in Revision B: Switching Characteristics values returned to Revision A valuesGo
  • Deleted inaccurate typical characteristics plot for operation across temperature.Go
  • Deleted unnecessary parameter measurement information for 15 pF load (unused).Go

Changes from A Revision (April 2008) to B Revision

  • Added Applications.Go
  • Added Device Information table.Go
  • Removed Ordering Information table.Go
  • Added DRY package to graphic figures and Pin Functions tableGo
  • Added Pin Functions table. Go
  • Added ESD Ratings table. Go
  • Added Thermal Information table. Go
  • Added Typical Characteristics. Go
  • Added Detailed Description section. Go
  • Added Application and Implementation section. Go
  • Revised Image for Typical ApplicationGo
  • Added Power Supply Recommendations section. Go
  • Added Layout section. Go
  • Added Device and Documentation Support section Go
  • Added Mechanical, Packaging, and Orderable Information section Go
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