米6体育平台手机版

SCES663C March 2006 – January 2020 SN74LVC1G17-Q1

PRODUCTION DATA.

请参考 PDF 数据表获取器件具体的封装图。

THERMAL METRIC⁽¹⁾		SN74LVC1G17-Q1			UNIT
		DBV	DCK	DRY
		5 PINS	5 PINS	6 PINS
R_θJA	Junction-to-ambient thermal resistance	229	280	608	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	164	66	432	°C/W
R_θJB	Junction-to-board thermal resistance	62	67	446	°C/W
ψ_JT	Junction-to-top characterization parameter	44	2	191	°C/W
ψ_JB	Junction-to-board characterization parameter	62	66	442	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	–	–	198	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.