米6体育平台手机版

ZHCSK62A February 2006 – August 2019 SN74LVC1G32-Q1

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		SN74LVC1G32-Q1			UNIT
		DBV	DCK	DRY
		5 PINS	5 PINS	6 PINS
R_θJA	Junction-to-ambient thermal resistance	229	278	439	°C/W
R_θJCtop	Junction-to-case (top) thermal resistance	164	93	277	°C/W
R_θJB	Junction-to-board thermal resistance	62	65	271	°C/W
ψ_JT	Junction-to-top characterization parameter	44	2	84	°C/W
ψ_JB	Junction-to-board characterization parameter	62	64	271	°C/W
R_θJCbot	Junction-to-case (bottom) thermal resistance	–	–	–	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.