SCES323Q June   2001  – March 2017 SN74LVC1G66

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Analog Switch Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DSF|6
  • DCK|5
  • DRL|5
  • YZP|5
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from P Revision (March 2016) to Q Revision

  • Changed the YZP package pin out graphicGo

Changes from O Revision (March 2015) to P Revision

  • Added Junction temperature spec to Absolute Maximum Ratings tableGo
  • Added "Control" to "Input transition rise and fall time" in Recommended Operating Conditions tableGo

Changes from N Revision (December 2012) to O Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Removed Ordering Information tableGo
  • Added Device Information tableGo

Changes from M Revision (January 2012) to N Revision

  • Added jumbo reel to Ordering Information tableGo

Changes from L Revision (January 2007) to M Revision

  • Added DSF and DRY package to pin out graphicGo
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