SCES307J August 2001 – July 2015 SN74LVC2G06
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DBV|6
- DSF|6
- YZP|6
- DCK|6
- DRY|6
散热焊盘机械数据 (封装 | 引脚)
- DRY|6
订购信息
1 Features
-
Available in the Texas Instruments
Package - Supports 5-V VCC Operation
- Max tpd of 3.4 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V - Ioff Supports Live Insertion, Partial-Power-Down Mode and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - Supports Down-Translation
(5 V to 3.3 V and 3.3 V to 1.8 V) - ESD Protection Exceeds JESD 22
- 2000-V Human Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
2 Applications
- AV Receivers
- Blu-ray Players and Home Theaters
- DVD Recorders and Players
- Desktop or Notebook PCs
- Digital Radio or Internet Radio Players
- Digital Video Cameras (DVC)
- Embedded PC
- GPS: Personal Navigation Devices
- Mobile Internet Devices
- Network Projector Front-End
- Portable Media Players
- Pro Audio Mixers
- Smoke Detectors
- Solid-State Drive (SSD): Enterprise
- High-Definition (HDTV)
3 Description
This dual inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06 device is an open-drain which can be connected to other open-drain outputs to implement active-low, wired-OR, or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Device Information(1)
| ORDER NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| SN74LVC2G06DBV | SOT-23 (6) | 2.90 mm × 1.60 mm |
| SN74LVC2G06DCK | SC70 (6) | 2.00 mm × 1.25 mm |
| SN74LVC2G06DRY | SON (6) | 1.45 mm × 1.00 mm |
| SN74LVC2G06DSF | SON (6) | 1.00 mm × 1.00 mm |
| SN74LVC2G06YZP | DSBGA (6) | 1.41 mm × 0.91 mm |
- For all available packages, see the orderable addendum at the end of the data sheet.
Logic Diagram
4 Revision History
Changes from I Revision (December 2013) to J Revision
- Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
Changes from H Revision (August 2012) to I Revision
- Updated document to new TI data sheet format.Go
- Removed Ordering Information table.Go
- Added ESD warning Go
- Updated operating temperature range.Go
Changes from G Revision (January 2007) to H Revision
- Updated package views and ordering information. Added DRY & DSF packagesGo