4 Revision History

Changes from P Revision (January 2016) to Q Revision

• Removed '200-V Machine Model' from Features for consistency with ESD ratings table. Go
• Added orderable part numbers associated with each package. Changed US8 to VSSOP.Go
• Updated YZP package drawing to match mechanical drawing pinout. Go
• Added YZP pin identifiers to Pin Function table. Added 'buffer #' to Description for pins 2, 3, 5, and 6. Changed 'Power pin' to 'Positive supply'Go
• Added updated package thermal values based on new models. Changes: R_θJA DCT 220 -> 199.0, DCU 227 -> 217.8, YZP 102 -> 99.8. Added: R_θJCtop, R_θJB, ψ_JT, ψ_JB.Go
• Added 'Balanced Push-Pull Outputs,' 'CMOS Inputs,' 'Clamp Diodes,' 'Partial Power Down, 'Over-voltage Tolerant Inputs.' Removed bullet list.Go
• Added improved layout guidelines and trace example image. Go
• Added Documentation Support section, Receiving Notification of Documentation Updates section, and Community Resources sectionGo

Changes from O Revision (January 2015) to P Revision

• Added overbar for active low to 1OE and 2OE to the Simplified SchematicGo
• Added T_J Junction temperature to the Absolute Maximum RatingsGo
• Added overbar for active low to 1OE and 2OE to the Functional Block DiagramGo

Changes from N Revision (November 2013) to O Revision

• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from M Revision (January 2007) to N Revision

• Updated Features.Go
• Updated document to new TI data sheet format.Go
• Removed Ordering Information table.Go
• Changed MAX operating temperature to 125°C in Recommended Operating Conditions table. Go