米6体育平台手机版

ZHCSJA5P April 1999 – January 2019 SN74LVC2G241

PRODUCTION DATA.

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请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DCU|8
YZP|8
DCT|8

散热焊盘机械数据 (封装 | 引脚)

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6.3 Recommended Operating Conditions⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage	Operating	1.65	5.5	V
V_CC	Supply voltage	Data retention only	1.5		V
V_IH	High-level input voltage	V_CC = 1.65 V to 1.95 V	0.65 × V_CC		V
		V_CC = 2.3 V to 2.7 V	1.7
		V_CC = 3 V to 3.6 V	2
		V_CC = 4.5 V to 5.5 V	0.7 × V_CC
V_IL	Low-level input voltage	V_CC = 1.65 V to 1.95 V		0.35 × V_CC	V
		V_CC = 2.3 V to 2.7 V		0.7
		V_CC = 3 V to 3.6 V		0.8
		V_CC = 4.5 V to 5.5 V		0.3 × V_CC
V_I	Input voltage		0	5.5	V
V_O	Output voltage	High or low state	0	V_CC	V
V_O	Output voltage	3-state	0	5.5	V
I_OH	High-level output current	V_CC = 1.65 V		–4	mA
		V_CC = 2.3 V		–8
		V_CC = 3 V		–16
		V_CC = 3 V		–24
		V_CC = 4.5 V		–32
I_OL	Low-level output current	V_CC = 1.65 V		4	mA
		V_CC = 2.3 V		8
		V_CC = 3 V		16
		V_CC = 3 V		24
		V_CC = 4.5 V		32
Δt/Δv	Input transition rise or fall rate	V_CC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V		20	ns/V
		V_CC = 3.3 V ± 0.3 V		10
		V_CC = 5 V ± 0.5 V		5
T_A	Operating free-air temperature		–40	85	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating CMOS Inputs, SCBA004.

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机械数据 (封装 | 引脚)

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.3 Recommended Operating Conditions(1)

6.3 Recommended Operating Conditions⁽¹⁾