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ZHCS198B June 2011 – October 2021 SN74LVC2G66-Q1

PRODUCTION DATA

7.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74LVC2G66-Q1	UNIT
		DCU (VSSOP)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	204.4	°C/W
R_θJCtop	Junction-to-case (top) thermal resistance	77	°C/W
R_θJB	Junction-to-board thermal resistance	83.2	°C/W
ψ_JT	Junction-to-top characterization parameter	7.1	°C/W
ψ_JB	Junction-to-board characterization parameter	82.7	°C/W
R_θJCbot	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.