ZHCSI94N July 2001 – August 2018 SN74LVC2G66
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SN74LVC2G66 | UNIT | |||
|---|---|---|---|---|---|
| DCT (SSOP) | DCU (VSSOP) | YZP (DSBGA) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 186.1 | 204.4 | 102 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 116.5 | 77 | — | °C/W |
| RθJB | Junction-to-board thermal resistance | 98.6 | 83.2 | — | °C/W |
| ψJT | Junction-to-top characterization parameter | 42.2 | 7.1 | — | °C/W |
| ψJB | Junction-to-board characterization parameter | 97.6 | 82.7 | — | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | — | °C/W |