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ZHCSRE6J March 1994 – December 2022 SN74LVC4245A

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.6 Thermal Information

THERMAL METRIC⁽¹⁾		SN74LVC4245A		UNIT
		DB	PW
		24 PINS
R_θJA	Junction-to-ambient thermal resistance	90.7	100.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.9	44.7	°C/W
R_θJB	Junction-to-board thermal resistance	49.7	55.8	°C/W
ψ_JT	Junction-to-top characterization parameter	18.8	6.8	°C/W
ψ_JB	Junction-to-board characterization parameter	49.3	55.4	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.