ZHCSV66 March   2024 SN74LVC7266A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|14
  • BQA|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

SN74LVC7266A 包含四个独立双输入异或非门。每个逻辑门以正逻辑执行布尔函数 Y = A ⊕ B

封装信息
器件型号封装(1)封装尺寸(2)封装尺寸(标称值)(3)
SN74LVC7266ABQA(WQFN,14)3mm × 2.5mm3mm × 2.5mm
PW(TSSOP,14)5mm × 6.4mm5mm × 4.4mm
如需了解更多信息,请参阅 节 11
封装尺寸(长 × 宽)为标称值,并包括引脚(如适用)。
本体尺寸(长 × 宽)为标称值,不包括引脚。
GUID-EF3D367D-0EBD-460E-AB80-15EAF17A702B-low.gif逻辑图