米6体育平台手机版

ZHCSRE4C june 2005 – december 2022 SN74LVC8T245

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information DB, DBQ and DGV

THERMAL METRIC⁽¹⁾		DB	DBQ	DGV	UNIT
THERMAL METRIC⁽¹⁾		24 PINS	24 PINS	24 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	90.7	81.2	91.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.9	44.8	23.7
R_θJB	Junction-to-board thermal resistance	49.7	34.5	44.5
ψ_JT	Junction-to-top characterization parameter	18.8	9.5	0.6
ψ_JB	Junction-to-board characterization parameter	49.3	37.2	44.1
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.