ZHCSRC6Q November   1996  – December 2022 SN74LVCC3245A

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 A Port (VCCA = 2.5 V ± 0.2 V and VCCB = 3.3 V ± 0.3 V)
    2. 7.2 B Port (VCCA = 2.5 V ± 0.2 V and VCCB = 3.3 V ± 0.3 V)
    3. 7.3 B Port (VCCA = 3.6 V and VCCB = 5.5 V)
    4. 7.4 A and B Port (VCCA and VCCB = 3.6 V)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1.      Application and Implementation
        1. 9.1 Application Information
        2. 9.2 Typical Application
          1. 9.2.1 Design Requirements
          2. 9.2.2 Detailed Design Procedure
          3. 9.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power-Up Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBQ|24
  • NS|24
  • DW|24
  • DB|24
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)(4)SN74LVCC3245AUNIT
DB (SSOP)DBQ (SSOP)PW (TSSOP)
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance

90.7

61

100.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.9

44.8

44.7

°C/W

RθJB

Junction-to-board thermal resistance

49.7

34.5

55.8

°C/W

ψJT

Junction-to-top characterization parameter

18.8

9.5

6.8

°C/W

ψJB

Junction-to-board characterization parameter

49.3

37.2

55.4

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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