ZHCSRE3N November   1996  – December 2022 SN74LVCC4245A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Power-Up Consideration
  8. 8 Parameter Measurement Information For A to B VCCA = 4.5 V to 5.5 V and VCCB = 2.7 V to 3.6 V
  9. 9 Parameter Measurement Information For A to B VCCA = 4.5 V to 5.5 V and VCCB = 3.6 V to 5.5 V
  10. 10Parameter Measurement Information For B to A VCCA = 4.5 V to 5.5 V and VCCB = 2.7 V to 3.6 V
  11. 11Parameter Measurement Information For B to A VCCA = 4.5 V to 5.5 V and VCCB = 3.6 V to 5.5 V
  12. 12Detailed Description
    1. 12.1 Overview
    2. 12.2 Functional Block Diagram
    3. 12.3 Feature Description
    4. 12.4 Device Functional Modes
  13. 13Application and Implementation
    1. 13.1 Application Information
    2. 13.2 Typical Application
      1. 13.2.1 Design Requirements
      2. 13.2.2 Detailed Design Procedure
      3. 13.2.3 Application Curves
  14. 14Power Supply Recommendations
  15. 15Layout
    1. 15.1 Layout Guidelines
    2. 15.2 Layout Example
  16. 16Device and Documentation Support
    1. 16.1 Documentation Support
      1. 16.1.1 Related Documentation
    2. 16.2 接收文档更新通知
    3. 16.3 支持资源
    4. 16.4 Trademarks
    5. 16.5 Electrostatic Discharge Caution
    6. 16.6 术语表
  17. 17Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NS|24
  • DW|24
  • DB|24
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)

SN74LVCC4245A

 UNIT

PW (TSSOP)

DB (SSOP)

24 PINS

24 PINS
R θJA Junction-to-ambient thermal resistance

100.6

90.7

 °C/W

RθJC(top)

Junction-to-case (top) thermal resistance

44.7

51.9

 °C/W
R θJB Junction-to-board thermal resistance

55.8

49.7

 °C/W
ψ JT Junction-to-top characterization parameter

6.8

18.8

 °C/W
ψ JB Junction-to-board characterization parameter

55.4

49.3

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
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