ZHCSIR4Q July   1995  – September 2018 SN54LVCH245A , SN74LVCH245A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Assignments: ZQN Package
    3.     Pin Assignments: ZXY Package
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: SN74LVCH245A
    4. 6.4  Recommended Operating Conditions: SN54LVCH245A
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics: SN74LVCH245A
    7. 6.7  Electrical Characteristics: SN54LVCH245A
    8. 6.8  Switching Characteristics: SN74LVCH245A, –40°C TO 85°C
    9. 6.9  Switching Characteristics: SN74LVCH245A, –40°C TO 125°C
    10. 6.10 Switching Characteristics: SN54LVCH245A
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Negative Clamping Diodes
      4. 8.3.4 Bus-Hold Data Inputs
      5. 8.3.5 Partial Power Down (Ioff)
      6. 8.3.6 Over-voltage Tolerant Inputs
      7. 8.3.7 Output Enable
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGV|20
  • DB|20
  • NS|20
  • DW|20
  • PW|20
  • RGY|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC(1) SN74LVCH245A UNIT
DB DGV DW NS PW RGY ZQN ZXY
20 PINS
RθJA Junction-to-ambient thermal resistance 94.5 114.7 88.3 74.7 102.5 41.4 129.3 123.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.2 29.8 51.1 40.5 35.9 47.7 75.3 58.9
RθJB Junction-to-board thermal resistance 49.7 56.2 50.9 42.3 53.5 17.1 77.6 74.8
ψJT Junction-to-top characterization parameter 18.1 0.8 20.0 14.3 2.2 1.4 2.6 2.0
ψJB Junction-to-board characterization parameter 49.2 55.5 50.5 41.9 52.9 17.1 73.2 74.4
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 9.8 n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
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