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7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

			MIN	MAX	UNIT
V_CC, BIAS V_CC	Supply voltage		–0.5	4.6	V
V_I	Input voltage⁽²⁾		–0.5	7	V
V_O	Voltage applied to any output in the high-impedance or power-off state⁽²⁾		–0.5	7	V
V_O	Voltage applied to any output in the high or low state⁽²⁾	3A port or Y output	–0.5	V_CC + 0.5	V
V_O	Voltage applied to any output in the high or low state⁽²⁾	B port	–0.5	4.6	V
I_O	Output current in the low state	3A port or Y output		50	mA
I_O	Output current in the low state	B port		100	mA
I_O	Output current in the high state	3A port or Y output		–50	mA
I_O	Output current in the high state	B port		–100	mA
I_IK	Input clamp current	V_I< 0		–50	mA
I_OK	Output clamp current	V_O< 0 or V_O > V_CC, B port		–50	mA
T_J	Junction temperature		–55	150	°C
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

see ⁽¹⁾⁽²⁾

			MIN	NOM	MAX	UNIT
V_CC, BIAS V_CC	Supply voltage		3.15	3.3	3.45	V
V_I	Input voltage	Control inputs or A port		V_CC	5.5	V
V_I	Input voltage	B port		V_CC	5.5	V
V_IH	High-level input voltage	Control inputs or A port	2			V
V_IH	High-level input voltage	B port	0.5 V_CC + 50 mV			V
V_IL	Low-level input voltage	Control inputs or A port			0.8	V
V_IL	Low-level input voltage	B port			0.5 V_CC – 50 mV	V
I_IK	Input clamp current				–18	mA
I_OH	High-level output current	3A port and Y output			–12	mA
I_OH	High-level output current	B port			–48	mA
I_OL	Low-level output current	3A port and Y output			12	mA
I_OL	Low-level output current	B port			64	mA
Δt/Δv	Input transition rise or fall rate	Outputs enabled			10	ns/V
Δt/ΔV_CC	Power-up ramp rate		20			µs/V
T_A	Operating ambient temperature	I version	–40		85	°C
T_A	Operating ambient temperature	M version	–55		125	°C

(1) All unused control inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

(2) Proper connection sequence for use of the B-port I/O precharge feature is GND and BIAS V_CC = 3.3 V first, I/O second, and V_CC = 3.3 V last, because the BIAS V_CC precharge circuitry is disabled when any V_CC pin is connected. The control inputs can be connected at any time, but normally are connected during the I/O stage. If B-port precharge is not required, any connection sequence is acceptable, but generally, GND is connected first.

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74VMEH22501A-EP		UNIT
		DGV (TVSOP)	DGG (TSSOP)
		48 PINS	48 PINS
R_θJA	Junction-to-ambient thermal resistance, JEDEC 4-layer high-K board	73.9	62.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	26.1	15.8	°C/W
R_θJB	Junction-to-board thermal resistance	37.3	30.0	°C/W
ψ_JT	Junction-to-top characterization parameter	1.9	0.7	°C/W
ψ_JB	Junction-to-board characterization parameter	36.8	29.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over recommended operating free-air temperature range for A and B ports (unless otherwise noted)

PARAMETER		TEST CONDITIONS		MIN	TYP⁽¹⁾	MAX	UNIT
V_IK		V_CC = 3.15 V	I_I = –18 mA			–1.2	V
V_OH	3A port, any B ports, and Y outputs	V_CC = 3.15 V to 3.45 V	I_OH = –100 µA	V_CC – 0.2			V
	3A port and Y outputs	V_CC = 3.15 V	I_OH = –6 mA	2.4
	3A port and Y outputs	V_CC = 3.15 V	I_OH = –12 mA	2
	Any B port	V_CC = 3.15 V	I_OH = –24 mA	2.4
	Any B port	V_CC = 3.15 V	I_OH = –48 mA	2
V_OL	3A port, any B ports, and Y outputs	V_CC = 3.15 V to 3.45 V	I_OL = 100 µA			0.2	V
	3A port and Y outputs	V_CC = 3.15 V	I_OL = 6 mA			0.55
			I_OL = 12 mA; I version; T_A = –40 to 85°C			0.8
			I_OL = 12 mA; M version; T_A = –55 to 125°C			0.84
	Any B port	V_CC = 3.15 V	I_OL = 24 mA			0.4
			I_OL = 48 mA			0.55
			I_OL = 64 mA; I version			0.6
			I_OL = 64 mA; M version			0.7
I_I	Control inputs, 1A and 2A	V_CC = 3.45 V	V_I = V_CC or GND			±1	µA
I_I	Control inputs, 1A and 2A	V_CC = 0 or 3.45 V	V_I = 5.5 V			5	µA
I VERSION
I_OZH⁽²⁾	3A port, any B port, and Y outputs	V_CC = 3.45 V; T_A = –40°C to 85°C	V_O = V_CCor 5.5 V			5	µA
I_OZL⁽²⁾	3A port and Y outputs	V_CC = 3.45 V; T_A = –40°C to 85°C	V_O = GND			–5	µA
I_OZL⁽²⁾	Any B port	V_CC = 3.45 V; T_A = –40°C to 85°C	V_O = GND			–20	µA
M VERSION
I_OZH⁽²⁾	3A port, any B port, and Y outputs	V_CC = 3.45 V; T_A = –55°C to 125°C	V_O = V_CCor 5.5 V			15	µA
I_OZL⁽²⁾	3A port and Y outputs	V_CC = 3.45 V; T_A = –55°C to 125°C	V_O = GND			–8	µA
I_OZL⁽²⁾	Any B port	V_CC = 3.45 V; T_A = –55°C to 125°C	V_O = GND			–35	µA
GENERAL PARAMETERS
I_off		V_CC = 0, BIAS V_CC= 0	V_I or V_O = 0 to 5.5 V			±10	µA
I_BHL⁽³⁾	3A port	V_CC = 3.15 V	V_I = 0.8 V	75			µA
I_BHH⁽⁴⁾	3A port	V_CC = 3.15 V	V_I = 2 V	–75			µA
I_BHLO⁽⁵⁾	3A port	V_CC = 3.45 V	V_I = 0 to V_CC	500			µA
I_BHHO⁽⁶⁾	3A port	V_CC = 3.45 V	V_I = 0 to V_CC	–500			µA
I_OZ(PU/PD)⁽⁷⁾		V_CC ≤ 1.3 V, V_O = 0.5 V to V_CC, V_I = GND or V_CC, OE = Don't care				±10	µA
I_CC		V_CC = 3.45 V, I_O = 0, V_I= V_CC or GND	Outputs high			30	mA
			Outputs low			30
			Outputs disabled			30
I_CCD		V_CC = 3.45 V, I_O = 0, V_I= V_CC or GND, One data input switching at one-half clock frequency, 50% duty cycle	Outputs enabled		76		µA/ clock MHz/ input
I_CCD			Outputs disabled		19		µA/ clock MHz/ input
ΔI_CC⁽⁸⁾		V_CC = 3.15 V to 3.45 V, One input at V_CC – 0.6 V, Other inputs at V_CC or GND				750	µA
C_i	1A and 2A inputs	V_I = 3.15 V or 0			2.8		pF
C_i	Control inputs	V_I = 3.15 V or 0			2.6		pF
C_o	1Y or 2Y outputs	V_O = 3.15 V or 0			5.6		pF
C_io	3A port	V_CC = 3.3 V	V_O = 3.3 V or 0		7.9		pF
C_io	Any B port	V_CC = 3.3 V	V_O = 3.3 V or 0		11	12.5	pF

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C.

(2) For I/O ports, the parameters I_OZH and I_OZL include the input leakage current.

(3) The bus-hold circuit can sink at least the minimum low sustaining current at V_IL max. I_BHL should be measured after lowering V_IN to GND, then raising it to V_IL max.

(4) The bus-hold circuit can source at least the minimum high sustaining current at V_IH min. I_BHH should be measured after raising V_IN to V_CC, then lowering it to V_IH min.

(5) An external driver must source at least I_BHLO to switch this node from low to high.

(6) An external driver must sink at least I_BHHO to switch this node from high to low.

(7) High-impedance state during power up or power down

(8) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V_CC or GND.

7.6 Live-Insertion Specifications

over recommended operating free-air temperature range for B port

PARAMETER	TEST CONDITIONS			MIN	TYP⁽¹⁾	MAX	UNIT
I_CC(BIAS V_CC)	V_CC = 0 to 3.15 V,	BIAS V_CC = 3.15 V to 3.45 V,	I_O(DC)= 0			5	mA
I_CC(BIAS V_CC)	V_CC = 3.15 V to 3.45 V⁽²⁾,	BIAS V_CC = 3.15 V to 3.45 V,	I_O(DC)= 0			10	µA
V_O	V_CC = 0,	BIAS V_CC = 3.15 V to 3.45 V		1.3	1.5	1.7	V
I_O	V_CC = 0	V_O = 0,	BIAS V_CC= 3.15 V	–20		–100	µA
I_O	V_CC = 0	V_O = 3 V,	BIAS V_CC= 3.15 V	20		100	µA

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C

(2) V_CC – 0.5 V < BIAS V_CC

7.7 Timing Requirements for UBT Transceiver (I Version)

over recommended operating conditions (unless otherwise noted) (see Figure 7 and Figure 8); T_A = –40°C to 85°C

				MIN	MAX	UNIT
f_clock	Clock frequency				120	MHz
t_w	Pulse duration	LE high		2.5		ns
t_w	Pulse duration	CLK high or low		3		ns
t_su	Setup time	3A before CLK↑	Data high	2.1		ns
		3A before CLK↑	Data low	2.2
		3A before LE↓	CLK high	2
		3A before LE↓	CLK low	2
		3B before CLK↑	Data high	2.5
		3B before CLK↑	Data low	2.7
		3B before LE↓	CLK high	2
		3B before LE↓	CLK low	2
t_h	Hold time	3A after CLK↑	Data high	0		ns
		3A after CLK↑	Data low	0
		3A after LE↓	CLK high	1
		3A after LE↓	CLK low	1
		3B after CLK↑	Data high	0
		3B after CLK↑	Data low	0
		3B after LE↓	CLK high	1
		3B after LE↓	CLK low	1

7.8 Switching Characteristics for Bus Transceiver Function (I Version)

over recommended operating conditions (unless otherwise noted) (see Figure 7 and Figure 8); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP	MAX	UNIT
t_PLH	1A or 2A	1B or 2B	4.5		9.2	ns
t_PHL	1A or 2A	1B or 2B	4.2		7.8	ns
t_PLH	1A or 2A	1Y or 2Y	6.2		14.5	ns
t_PHL	1A or 2A	1Y or 2Y	6.1		13	ns
t_PZH	OEAB	1B or 2B	3.6		8.1	ns
t_PZL	OEAB	1B or 2B	3.4		7.8	ns
t_PHZ	OEAB	1B or 2B	3.3		9.7	ns
t_PLZ	OEAB	1B or 2B	1.8		4.8	ns
t_r	Transition time, B port (10%–90%)			4.3		ns
t_f	Transition time, B port (90%–10%)			4.3		ns
t_PLH	1B or 2B	1Y or 2Y	1.6		5.6	ns
t_PHL	1B or 2B	1Y or 2Y	1.6		5.6	ns
t_PZH	OEBY	1Y or 2Y	1.2		5.6	ns
t_PZL	OEBY	1Y or 2Y	1.8		4.9	ns
t_PHZ	OEBY	1Y or 2Y	0.9		5.4	ns
t_PLZ	OEBY	1Y or 2Y	1.4		4.5	ns

7.9 Switching Characteristics for Bus Transceiver Function (M Version)

over recommended operating conditions (unless otherwise noted) (see Figure 7 and Figure 8); T_A = –55°C to 125°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP	MAX	UNIT
t_PLH	1A or 2A	1B or 2B	4.5		10.8	ns
t_PHL	1A or 2A	1B or 2B	4.2		10.6	ns
t_PLH	1A or 2A	1Y or 2Y	6.2		15.7	ns
t_PHL	1A or 2A	1Y or 2Y	6.1		15.7	ns
t_PZH	OEAB	1B or 2B	3.6		9.8	ns
t_PZL	OEAB	1B or 2B	2.8		8.7	ns
t_PHZ	OEAB	1B or 2B	3.3		9.7	ns
t_PLZ	OEAB	1B or 2B	1.8		5.6	ns
t_r	Transition time, B port (10%–90%)			4.3		ns
t_f	Transition time, B port (90%–10%)			4.3		ns
t_PLH	1B or 2B	1Y or 2Y	1.6		6.8	ns
t_PHL	1B or 2B	1Y or 2Y	1.6		6.7	ns
t_PZH	OEBY	1Y or 2Y	1.2		6.9	ns
t_PZL	OEBY	1Y or 2Y	1.8		6.6	ns
t_PHZ	OEBY	1Y or 2Y	0.9		6.8	ns
t_PLZ	OEBY	1Y or 2Y	1.4		5.4	ns

7.10 Switching Characteristics for UBT Transceiver (I Version)

over recommended operating conditions (unless otherwise noted) (see Figure 7 and Figure 8); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP	MAX	UNIT
f_max			120			MHz
t_PLH	3A	3B	4.8		9.5	ns
t_PHL	3A	3B	4.5		8.3	ns
t_PLH	LE	3B	5.2		10.6	ns
t_PHL	LE	3B	4.7		8.7	ns
t_PLH	CLKAB	3B	5.4		10.5	ns
t_PHL	CLKAB	3B	4.2		8.4	ns
t_PZH	OE	3B	4.2		9.3	ns
t_PZL	OE	3B	2.8		8.5	ns
t_PHZ	OE	3B	4.2		9.3	ns
t_PLZ	OE	3B	2.4		5.7	ns
t_r	Transition time, B port (10%–90%)			4.3		ns
t_f	Transition time, B port (90%–10%)			4.3		ns
t_PLH	3B	3A	1.5		5.9	ns
t_PHL	3B	3A	1.7		5.9	ns
t_PLH	LE	3A	1.7		5.9	ns
t_PHL	LE	3A	1.7		5.9	ns
t_PLH	CLKBA	3A	1.1		5.5	ns
t_PHL	CLKBA	3A	1.4		5.5	ns
t_PZH	OE	3A	1.5		6.2	ns
t_PZL	OE	3A	2.1		5.5	ns
t_PHZ	OE	3A	0.8		6.2	ns
t_PLZ	OE	3A	2.3		5.6	ns

7.11 Switching Characteristics for UBT Transceiver (M Version)

over recommended operating conditions (unless otherwise noted) (see Figure 7 and Figure 8); T_A = –55°C to 125°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP	MAX	UNIT
f_max			120			MHz
t_PLH	3A	3B	4.8		11.5	ns
t_PHL	3A	3B	4.5		11.8	ns
t_PLH	LE	3B	5.2		12.9	ns
t_PHL	LE	3B	4.7		11.6	ns
t_PLH	CLKAB	3B	5.4		13.8	ns
t_PHL	CLKAB	3B	4.2		11.9	ns
t_PZH	OE	3B	4.2		11.9	ns
t_PZL	OE	3B	2.8		10.7	ns
t_PHZ	OE	3B	4.2		11.9	ns
t_PLZ	OE	3B	2.4		9.1	ns
t_r	Transition time, B port (10%–90%)			4.3		ns
t_f	Transition time, B port (90%–10%)			4.3		ns
t_PLH	3B	3A	1.5		7.6	ns
t_PHL	3B	3A	1.7		7.9	ns
t_PLH	LE	3A	1.7		7.9	ns
t_PHL	LE	3A	1.7		7.9	ns
t_PLH	CLKBA	3A	1.1		5.7	ns
t_PHL	CLKBA	3A	1.4		6.4	ns
t_PZH	OE	3A	1.5		7.9	ns
t_PZL	OE	3A	2.1		7.5	ns
t_PHZ	OE	3A	0.8		10.5	ns
t_PLZ	OE	3A	2.3		6.9	ns

7.12 Switching Characteristics for Bus Transceiver Function (I Version)

driver in slot 11, with receiver cards in all other slots (full load); over recommended operating conditions (unless otherwise noted) (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP⁽¹⁾	MAX	UNIT
t_PLH	1A or 2A	1B or 2B	5.9		8.5	ns
t_PHL	1A or 2A	1B or 2B	5.5		8.7	ns
t_r⁽²⁾	Transition time, B port (10%–90%)		9	8.6	11.4	ns
t_f⁽²⁾	Transition time, B port (90%–10%)		8.9	9	10.8	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) All t_r and t_f times are taken at the first receiver.

7.13 Switching Characteristics for UBT (I Version)

driver in slot 11, with receiver cards in all other slots (full load); over recommended operating conditions (unless otherwise noted) (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP⁽¹⁾	MAX	UNIT
t_PLH	3A	3B	6.2		8.9	ns
t_PHL	3A	3B	5.6		9	ns
t_PLH	LE	3B	6.1		9.1	ns
t_PHL	LE	3B	5.6		9	ns
t_PLH	CLKAB	3B	6.2		9.1	ns
t_PHL	CLKAB	3B	5.7		9	ns
t_r⁽²⁾	Transition time, B port (10%–90%)		9	8.6	11.4	ns
t_f⁽²⁾	Transition time, B port (90%–10%)		8.9	9	10.8	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) All t_r and t_f times are taken at the first receiver.

7.14 Switching Characteristics for Bus Transceiver Function (I Version)

driver in slot 1, with one receiver in slot 21 (minimum load); over recommended operating conditions (unless otherwise noted) (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP⁽¹⁾	MAX	UNIT
t_PLH	1A or 2A	1B or 2B	5.5		7.4	ns
t_PHL	1A or 2A	1B or 2B	5.3		7.4	ns
t_r⁽²⁾	Transition time, B port (10%–90%)		3.9	3.4	4.4	ns
t_f⁽²⁾	Transition time, B port (90%–10%)		3.7	3.4	4.8	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) All t_r and t_f times are taken at the first receiver.

7.15 Switching Characteristics for UBT (I Version)

driver in slot 1, with one receiver in slot 21 (minimum load); over recommended operating conditions (unless otherwise noted) (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP⁽¹⁾	MAX	UNIT
t_PLH	3A	3B	5.8		7.9	ns
t_PHL	3A	3B	5.5		7.7	ns
t_PLH	LE	3B	5.9		8	ns
t_PHL	LE	3B	5.5		7.8	ns
t_PLH	CLKAB	3B	5.9		8.1	ns
t_PHL	CLKAB	3B	5.5		7.7	ns
t_r⁽²⁾	Transition time, B port (10%–90%)		3.9	3.4	4.4	ns
t_f⁽²⁾	Transition time, B port (90%–10%)		3.7	3.4	4.8	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) All t_r and t_f times are taken at the first receiver.

7.16 Skew Characteristics for Bus Transceiver (I Version)

for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 7 and Figure 8); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MAX	UNIT
t_sk(LH)	1A or 2A	1B or 2B	0.8	ns
t_sk(HL)	1A or 2A	1B or 2B	0.7	ns
t_sk(LH)	1B or 2B	1Y or 2Y	0.7	ns
t_sk(HL)	1B or 2B	1Y or 2Y	0.7	ns
t_sk(t)⁽¹⁾	1A or 2A	1B or 2B	3.9	ns
t_sk(t)⁽¹⁾	1B or 2B	1Y or 2Y	1.5	ns
t_sk(pp)	1A or 2A	1B or 2B	3.6	ns
t_sk(pp)	1B or 2B	1Y or 2Y	1.4	ns

(1) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.17 Skew Characteristics for Bus Transceiver (M Version)

for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 7 and Figure 8); T_A = –55°C to 125°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MAX	UNIT
t_sk(LH)	1A or 2A	1B or 2B	1.6	ns
t_sk(HL)	1A or 2A	1B or 2B	1.6	ns
t_sk(LH)	1B or 2B	1Y or 2Y	1.6	ns
t_sk(HL)	1B or 2B	1Y or 2Y	1.6	ns
t_sk(t)⁽¹⁾	1A or 2A	1B or 2B	3.9	ns
t_sk(t)⁽¹⁾	1B or 2B	1Y or 2Y	2.5	ns
t_sk(pp)	1A or 2A	1B or 2B	3.6	ns
t_sk(pp)	1B or 2B	1Y or 2Y	2.4	ns

(1) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.18 Skew Characteristics for UBT (I Version)

for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 7 and Figure 8); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MAX	UNIT
t_sk(LH)	3A	3B	1.4	ns
t_sk(HL)	3A	3B	1.1	ns
t_sk(LH)	CLKAB	3B	0.8	ns
t_sk(HL)	CLKAB	3B	0.8	ns
t_sk(LH)	3B	3A	0.7	ns
t_sk(HL)	3B	3A	0.6	ns
t_sk(LH)	CLKBA	3A	0.7	ns
t_sk(HL)	CLKBA	3A	0.6	ns
t_sk(t)⁽¹⁾	3A	3B	3.9	ns
	CLKAB	3B	3.9
	3B	3A	1.6
	CLKBA	3A	1.2
t_sk(pp)	3A	3B	3.6	ns
	CLKAB	3B	3.5
	3B	3A	1.3
	CLKBA	3A	1.2

(1) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.19 Skew Characteristics for UBT (M Version)

for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 7 and Figure 8); T_A = –55°C to 125°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MAX	UNIT
t_sk(LH)	3A	3B	1.6	ns
t_sk(HL)	3A	3B	1.4	ns
t_sk(LH)	CLKAB	3B	1.3	ns
t_sk(HL)	CLKAB	3B	1.3	ns
t_sk(LH)	3B	3A	1.2	ns
t_sk(HL)	3B	3A	1.2	ns
t_sk(LH)	CLKBA	3A	1.3	ns
t_sk(HL)	CLKBA	3A	1.3	ns
t_sk(t)⁽¹⁾	3A	3B	4.3	ns
	CLKAB	3B	3.9
	3B	3A	2.9
	CLKBA	3A	2.5
t_sk(pp)	3A	3B	3.6	ns
	CLKAB	3B	3.5
	3B	3A	1.3
	CLKBA	3A	1.2

(1) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.20 Skew Characteristics for Bus Transceiver (I Version)

driver in slot 11, with receiver cards in all other slots (full load); for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	TYP⁽¹⁾	MAX	UNIT
t_sk(LH)	1A or 2A	1B or 2B		2.5	ns
t_sk(HL)	1A or 2A	1B or 2B		3	ns
t_sk(t)⁽²⁾	1A or 2A	1B or 2B		1	ns
t_sk(pp)	1A or 2A	1B or 2B	0.5	3.4	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.21 Skew Characteristics for UBT (I Version)

driver in slot 11, with receiver cards in all other slots (full load); for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	TYP⁽¹⁾	MAX	UNIT
t_sk(LH)	3A	3B		2.4	ns
t_sk(HL)	3A	3B		3.4	ns
t_sk(LH)	CLKAB	3B		2.7	ns
t_sk(HL)	CLKAB	3B		3.4	ns
t_sk(t)⁽²⁾	3A	3B		1	ns
t_sk(t)⁽²⁾	CLKAB	3B		1	ns
t_sk(pp)	3A	3B	0.5	3.4	ns
t_sk(pp)	CLKAB	3B	0.6	3.5	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.22 Skew Characteristics for Bus Transceiver (I Version)

driver in slot 1, with one receiver in slot 21 (minimum load); for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	TYP⁽¹⁾	MAX	UNIT
t_sk(LH)	1A or 2A	1B or 2B		1.7	ns
t_sk(HL)	1A or 2A	1B or 2B		2.1	ns
t_sk(t)⁽²⁾	1A or 2A	1B or 2B		1	ns
t_sk(pp)	1A or 2A	1B or 2B	0.2	2.1	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.23 Skew Characteristics for UBT (I Version)

driver in slot 1, with one receiver in slot 21 (minimum load); for specific worst-case V_CC and temperature within the recommended ranges of supply voltage and operating free-air temperature (see Figure 6); T_A = –40°C to 85°C

PARAMETER	FROM (INPUT)	TO (OUTPUT)	TYP⁽¹⁾	MAX	UNIT
t_sk(LH)	3A	3B		2	ns
t_sk(HL)	3A	3B		2.3	ns
t_sk(LH)	CLKAB	3B		2.1	ns
t_sk(HL)	CLKAB	3B		2.4	ns
t_sk(t)⁽²⁾	3A	3B		1	ns
t_sk(t)⁽²⁾	CLKAB	3B		1	ns
t_sk(pp)	3A	3B	0.2	2.5	ns
t_sk(pp)	CLKAB	3B	0.2	2.9	ns

(1) All typical values are at V_CC = 3.3 V, T_A = 25°C. All values are derived from TI-SPICE models.

(2) t_sk(t) – Output-to-output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs of the same packaged device. The specifications are given for specific worst-case V_CC and temperature and apply to any outputs switching in opposite directions, both low to high (LH) and high to low (HL) [t_sk(t)].

7.24 Maximum Data Transfer Rates

DATE	TOPOLOGY	PROTOCOL	DATA (BITS PER CYCLE)	DATA TRANSFERS PER CLOCK CYCLE	PER SYSTEM (MBps)	FREQUENCY (MHz)
DATE	TOPOLOGY	PROTOCOL	DATA (BITS PER CYCLE)	DATA TRANSFERS PER CLOCK CYCLE	PER SYSTEM (MBps)	BACKPLANE	CLOCK
1981	VMEbus IEEE-1014	BLT	32	1	40	10	10
1989	VME64	MBLT	64	1	80	10	10
1995	VME64x	2eVME	64	2	160	10	20
1997	VME64x	2eSST	64	2-No Ack	160 to 320	10 to 20	20 to 40
1999	VME320	2eSST	64	2-No Ack	320 to 1000	20 to 62.5	40 to 125

7.25 Typical Characteristics

Figure 2. Supply Current vs Frequency A to B

SN74VMEH22501A-EP g_vol_v_iol_ces357.gif

Figure 4. High-Level Output Voltage vs High-Level Output Current, V_OL vs I_OL

Figure 3. Supply Current vs Frequency B to A

SN74VMEH22501A-EP g_voh_v_ioh_ces357.gif

Figure 5. Low-Level Output Voltage vs Low-Level Output Current, V_OH vs I_OH

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7 Specifications

7.1 Absolute Maximum Ratings

7.2 ESD Ratings

7.3 Recommended Operating Conditions

7.4 Thermal Information

7.5 Electrical Characteristics

7.6 Live-Insertion Specifications

7.7 Timing Requirements for UBT Transceiver (I Version)

7.8 Switching Characteristics for Bus Transceiver Function (I Version)

7.9 Switching Characteristics for Bus Transceiver Function (M Version)

7.10 Switching Characteristics for UBT Transceiver (I Version)

7.11 Switching Characteristics for UBT Transceiver (M Version)

7.12 Switching Characteristics for Bus Transceiver Function (I Version)

7.13 Switching Characteristics for UBT (I Version)

7.14 Switching Characteristics for Bus Transceiver Function (I Version)

7.15 Switching Characteristics for UBT (I Version)

7.16 Skew Characteristics for Bus Transceiver (I Version)

7.17 Skew Characteristics for Bus Transceiver (M Version)

7.18 Skew Characteristics for UBT (I Version)

7.19 Skew Characteristics for UBT (M Version)

7.20 Skew Characteristics for Bus Transceiver (I Version)

7.21 Skew Characteristics for UBT (I Version)

7.22 Skew Characteristics for Bus Transceiver (I Version)

7.23 Skew Characteristics for UBT (I Version)

7.24 Maximum Data Transfer Rates

7.25 Typical Characteristics