ZHCSTI8F October 1980 – October 2023 SN55173 , SN75173
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | D (SOIC) | N (PDIP) | NS (SOP) | J (CDIP) | UNIT | |
|---|---|---|---|---|---|---|
| 16-PINS | ||||||
| R θJA | Junction-to-ambient thermal resistance | 84.6 | 60.6 | 88.5 | 65.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 48.1 | 46.2 | 54.6 | °C/W |
| R θJB | Junction-to-board thermal resistance | 43.2 | 40.6 | 50.7 | 42.1 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 10.4 | 27.5 | 13.5 | 22.9 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 42.8 | 40.3 | 50.3 | 41.6 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | n/a | °C/W |