米6体育平台手机版

ZHCSW06C October 1980 – April 2024 SN75174

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		N (PDIP)	DW	UNIT
THERMAL METRIC⁽¹⁾		16 PINS	20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	60.6	66.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	48.1	34.4	°C/W
R_θJB	Junction-to-board thermal resistance	40.6	39.7	°C/W
ψ_JT	Junction-to-top characterization parameter	27.5	8.9	°C/W
ψ_JB	Junction-to-board characterization parameter	40.3	39	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.