ZHCS202E April   2011  – March 2015 SN75DP130

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Dissipation
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Reset Signal
      2. 9.3.2 Hot Plug Detect and Cable Adapter Detect
      3. 9.3.3 AUX and DDC Configuration
      4. 9.3.4 Main Link Configuration
      5. 9.3.5 Link Training and DPCD
      6. 9.3.6 Equalization
      7. 9.3.7 Configurable Outputs
      8. 9.3.8 Squelch
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 I2C Interface Overview
    6. 9.6 Register Maps
      1. 9.6.1 SN75DP130 Local I2C Control and Status Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Logic I2C Interface
        2. 10.2.2.2 CAD Sink Over Ride
        3. 10.2.2.3 HPD Sink Over Ride
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 SN75DP130 Power Sequencing
      1. 11.1.1 Power-Up Sequence:
      2. 11.1.2 Power-Down Sequence:
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layer Stack
      2. 12.1.2 Differential Traces
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 商标
    2. 13.2 静电放电警告
    3. 13.3 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (July 2013) to E Revision

  • Added 引脚配置和功能部分，ESD 额定值表，特性描述部分，器件功能模式部分，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go

Changes from C Revision (January 2013) to D Revision

  • Power-Down Sequence deleted: 1. De-assert EN to the deviceGo
  • Power-Up Sequence deleted: 1. Assert RSTN and de-assert EN to the device.Go
  • Power-Up Sequence deleted: 5. Assert EN a minimum of 10 µs after RSTN has been de-asserted. Go
  • Deleted the EN time line from Figure 34Go

Changes from B Revision (October 2011) to C Revision

  • Added text to RSTN description in PIN FUNCTIONSGo
  • Added RSTN pin row to VIH in RECOMMENDED OPERATING CONDITIONSGo
  • Added RSTN pin row to VIL in RECOMMENDED OPERATING CONDITIONSGo
  • Added rows to Device power under normal operation in POWER DISSIPATION tableGo
  • Changed in Table 1 13.9 to 113.9Go
  • Deleted unnecessary tie dot in Block DiagramGo
  • Changed Table 3Go
  • Changed Figure 17Go
  • Changed Figure 18Go
  • Changed SN75DP130 Local I2C Control and Status RegistersGo
  • Added DP130 POWER SEQUENCING sectionGo

Changes from A Revision (September 2011) to B Revision

  • Deleted pins 37 an 43 from GND in the PIN FUNCTIONS tableGo

Changes from * Revision (April 2011) to A Revision

  • Changed pin numbers in PIN FUNCTIONS table, VDDD_DREG and NCGo
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