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ZHCSW12G October 2000 – April 2024 SN65LBC174A , SN75LBC174A

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN75ALS174A			UNIT
		N (PDIP)	DW (SOIC)	DW
		16 PINS	16 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	60.6	71.1	66.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	48.1	37.4	34.4	°C/W
R_θJB	Junction-to-board thermal resistance	40.6	36.8	39.7	°C/W
ψ_JT	Junction-to-top characterization parameter	27.5	13.3	8.9	°C/W
ψ_JB	Junction-to-board characterization parameter	40.3	36.4	39	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.