ZHCSQI5I August   1990  – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176

PRODUCTION DATA  

  1. 特性
  2. 说明
  3. Revision History
  4. 说明(续)
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information: SN55LBC176
    4. 6.4 Thermal Information: SN65LBC176, SN75LBC176
    5. 6.5 Dissipation Ratings
    6. 6.6 Driver Electrical Characteristics
    7. 6.7 Driver Switching Characteristics
    8. 6.8 Receiver Electrical Characteristics
    9. 6.9 Receiver Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Thermal Characteristics of IC Packages
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Dissipation Ratings

PACKAGETHERMAL
MODEL
TA < 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
TA = 110°C
POWER RATING
DLow K(1)526 mW5.0 mW/°C301 mW226 mW
High K(2)882 mW8.4 mW/°C504 mW378 mW
P840 mW8.0 mW/°C480 mW360 mW
JG1050 mW8.4 mW/°C672 mW546 mW210 mW
FK1375 mW11.0 mW/°C880 mW715 mW440 mW
In accordance with the low effective thermal conductivity metric definitions of EIA/JESD 51−3.
In accordance with the high effective thermal conductivity metric definitions of EIA/JESD 51−7.