SLLS362G SEPTEMBER   1999  – January 2016 SN65LVDS387 , SN65LVDS389 , SN65LVDS391 , SN75LVDS387 , SN75LVDS389 , SN75LVDS391

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Driver Output Voltage and Power-On Reset
      2. 10.3.2 5-V Input Tolerance
      3. 10.3.3 NC Pins
      4. 10.3.4 Unused Enable Pins
      5. 10.3.5 Driver Equivalent Schematics
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Signaling Rate vs Distance
    2. 11.2 Typical Application
      1. 11.2.1 Point-to-Point Communications
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Driver Supply Voltage
          2. 11.2.1.2.2 Driver Bypass Capacitance
          3. 11.2.1.2.3 Driver Output Voltage
          4. 11.2.1.2.4 Interconnecting Media
          5. 11.2.1.2.5 PCB Transmission Lines
          6. 11.2.1.2.6 Termination Resistor
          7. 11.2.1.2.7 Driver NC Pins
        3. 11.2.1.3 Application Curve
      2. 11.2.2 Multidrop Communications
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
          1. 11.2.2.2.1 Interconnecting Media
        3. 11.2.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
      2. 14.1.2 Other LVDS Products
    2. 14.2 Documentation Support
      1. 14.2.1 Related Information
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBT|38
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 Device and Documentation Support

14.1 Device Support

14.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

14.1.2 Other LVDS Products

For other products and application notes in the LVDS and LVDM product families visit our Web site at http://www.ti.com/sc/datatran.

14.2 Documentation Support

14.2.1 Related Information

IBIS modeling is available for this device. Contact the local TI sales office or the TI Web site at www.ti.com for more information.

For more application guidelines, see the following documents:

  • Low-Voltage Differential Signaling Design Notes (SLLA014)
  • Interface Circuits for TIA/EIA-644 (LVDS) (SLLA038)
  • Reducing EMI With LVDS (SLLA030)
  • Slew Rate Control of LVDS Circuits (SLLA034)
  • Using an LVDS Receiver With RS-422 Data (SLLA031)
  • Evaluating the LVDS EVM (SLLA033)

14.3 Related Links

Table 3 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
SN65LVDS387 Click here Click here Click here Click here Click here
SN75LVDS387 Click here Click here Click here Click here Click here
SN65LVDS389 Click here Click here Click here Click here Click here
SN75LVDS389 Click here Click here Click here Click here Click here
SN65LVDS391 Click here Click here Click here Click here Click here
SN75LVDS391 Click here Click here Click here Click here Click here

14.4 Trademarks

Rogers is a trademark of Rogers Corporation.

All other trademarks are the property of their respective owners.

14.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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