SLASF33 January   2024 TAC5412-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements: I2C Interface
    8. 5.8  Switching Characteristics: I2C Interface
    9. 5.9  Timing Requirements: SPI Interface
    10. 5.10 Switching Characteristics: SPI Interface
    11. 5.11 Timing Requirements: TDM, I2S or LJ Interface
    12. 5.12 Switching Characteristics: TDM, I2S or LJ Interface
    13. 5.13 Timing Requirements: PDM Digital Microphone Interface
    14. 5.14 Switching Characteristics: PDM Digial Microphone Interface
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
      2. 6.3.2  Using Multiple Devices With Shared Buses
      3. 6.3.3  Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4  Input Channel Configuration
      5. 6.3.5  Reference Voltage
      6. 6.3.6  Microphone Bias
      7. 6.3.7  Input DC Fault Diagnostics
        1. 6.3.7.1 Fault Conditions
          1. 6.3.7.1.1 Input Pin Short to Ground
          2. 6.3.7.1.2 Input Pin Short to MICBIAS
          3. 6.3.7.1.3 Open Inputs
          4. 6.3.7.1.4 Short Between INxP and INxM
          5. 6.3.7.1.5 Input Pin Overvoltage
          6. 6.3.7.1.6 Input Pin Short to VBAT_IN
        2. 6.3.7.2 Fault Reporting
          1. 6.3.7.2.1 Overcurrent and Overtemperature Protection
      8. 6.3.8  Signal-Chain Processing
        1. 6.3.8.1 ADC Signal-Chain
          1. 6.3.8.1.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.8.1.2 Programmable Channel Gain Calibration
          3. 6.3.8.1.3 Programmable Channel Phase Calibration
          4. 6.3.8.1.4 Programmable Digital High-Pass Filter
          5. 6.3.8.1.5 Programmable Digital Biquad Filters
          6. 6.3.8.1.6 Programmable Channel Summer and Digital Mixer
          7. 6.3.8.1.7 Configurable Digital Decimation Filters
            1. 6.3.8.1.7.1 Linear Phase Filters
              1. 6.3.8.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 6.3.8.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 6.3.8.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 6.3.8.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 6.3.8.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 6.3.8.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
      9. 6.3.9  DAC Signal-Chain
        1. 6.3.9.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.9.2 Programmable Channel Gain Calibration
        3. 6.3.9.3 Programmable Digital High-Pass Filter
        4. 6.3.9.4 Programmable Digital Biquad Filters
        5. 6.3.9.5 Programmable Digital Mixer
        6. 6.3.9.6 Configurable Digital Interpolation Filters
          1. 6.3.9.6.1 Linear Phase Filters
            1. 6.3.9.6.1.1 Sampling Rate: 16kHz or 14.7kHz
            2. 6.3.9.6.1.2 Sampling Rate: 24kHz or 22.05kHz
            3. 6.3.9.6.1.3 Sampling Rate: 32kHz or 29.4kHz
            4. 6.3.9.6.1.4 Sampling Rate: 48kHz or 44.1kHz
            5. 6.3.9.6.1.5 Sampling Rate: 96kHz or 88.2kHz
            6. 6.3.9.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
  8. 7 Register Maps
    1. 7.1 Page 0 Registers
    2. 7.2 Page 1 Registers
    3. 7.3 Page_3 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
6.3.7.2.1 Overcurrent and Overtemperature Protection

The device has an overcurrent protection circuit that limits the current drawn out of the MICBIAS output to the maximum supported level when an external undesired short event occurs on the MICBIAS pin. The device sets the status flag, P1_R59_D2 bit, on an overcurrent detection. Additionally, the device has an overtemperature detection circuit that is enabled by default and sets the status flag, P1_R52_D5 bit, whenever the die junction temperature goes higher than the supported level.

Additionally, the P1_R80 and P0_R66_D[4:3] register can be configured to shutdown MICBIAS along with the on-chip boost on an overtemperature detection. TI recommends configuring PD_ON_FLT_CFG, P0_R66_D4-3 to '10' so that on an overtemperature detection, the device powers-down MICBIAS, the on-chip boost, and all ADC channels.

More details and information on fault diagnostics are discussed in the TAC5xxx-Q1 Fault Diagnostics, Interrupts, and Protection Features application report.
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