ZHCS328C february   2013  – september 2021 TAS2505

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  I2S/LJF/RJF Timing in Master Mode
    7. 6.7  I2S/LJF/RJF Timing in Slave Mode
    8. 6.8  DSP Timing in Master Mode
    9. 6.9  DSP Timing in Slave Mode
    10. 6.10 I2C Interface Timing
    11. 6.11 SPI Interface Timing
    12. 6.12 Typical Characteristics
      1. 6.12.1 Class D Speaker Driver Performance
      2. 6.12.2 HP Driver Performance
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Audio Analog I/O
      2. 7.3.2 Audio DAC and Audio Analog Outputs
      3. 7.3.3 DAC
      4. 7.3.4 POR
      5. 7.3.5 CLOCK Generation and PLL
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Pins
      2. 7.4.2 Analog Pins
      3. 7.4.3 Multifunction Pins
      4. 7.4.4 Analog Signals
        1. 7.4.4.1 Analog Inputs AINL and AINR
      5. 7.4.5 DAC Processing Blocks — Overview
      6. 7.4.6 Digital Mixing and Routing
      7. 7.4.7 Analog Audio Routing
      8. 7.4.8 Digital Audio and Control Interface
        1. 7.4.8.1 Digital Audio Interface
        2. 7.4.8.2 Control Interface
          1. 7.4.8.2.1 I2C Control Mode
          2. 7.4.8.2.2 SPI Digital Interface
        3. 7.4.8.3 Device Special Functions
    5. 7.5 Register Map
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  11. 9 Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

6.4 Thermal Information

THERMAL METRIC(1)TAS2505UNIT
RGE (QFN)
24 PINS
θJAJunction-to-ambient thermal resistance32.2°C/W
θJCtopJunction-to-case (top) thermal resistance30°C/W
θJBJunction-to-board thermal resistance9.2°C/W
ψJTJunction-to-top characterization parameter0.3°C/W
ψJBJunction-to-board characterization parameter9.2°C/W
θJCbotJunction-to-case (bottom) thermal resistance2.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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