ZHCS328C february   2013  – september 2021 TAS2505

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  I2S/LJF/RJF Timing in Master Mode
    7. 6.7  I2S/LJF/RJF Timing in Slave Mode
    8. 6.8  DSP Timing in Master Mode
    9. 6.9  DSP Timing in Slave Mode
    10. 6.10 I2C Interface Timing
    11. 6.11 SPI Interface Timing
    12. 6.12 Typical Characteristics
      1. 6.12.1 Class D Speaker Driver Performance
      2. 6.12.2 HP Driver Performance
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Audio Analog I/O
      2. 7.3.2 Audio DAC and Audio Analog Outputs
      3. 7.3.3 DAC
      4. 7.3.4 POR
      5. 7.3.5 CLOCK Generation and PLL
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Pins
      2. 7.4.2 Analog Pins
      3. 7.4.3 Multifunction Pins
      4. 7.4.4 Analog Signals
        1. 7.4.4.1 Analog Inputs AINL and AINR
      5. 7.4.5 DAC Processing Blocks — Overview
      6. 7.4.6 Digital Mixing and Routing
      7. 7.4.7 Analog Audio Routing
      8. 7.4.8 Digital Audio and Control Interface
        1. 7.4.8.1 Digital Audio Interface
        2. 7.4.8.2 Control Interface
          1. 7.4.8.2.1 I2C Control Mode
          2. 7.4.8.2.2 SPI Digital Interface
        3. 7.4.8.3 Device Special Functions
    5. 7.5 Register Map
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  11. 9 Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision B (November 2016) to Revision C (September 2021)

  • 在整个数据表中删除了所有对 LDO 模式和 LDO_SEL 引脚的引用Go

Changes from Revision A (February 2013) to Revision B (November 2016)

  • 添加了器件信息 表、ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分。Go

Changes from Revision * (February 2013) to Revision A (February 2013)

  • Deleted PO (Max Output power) SPKVDD = 5.5 V, THD = 10%Go
  • Changed PO (Max Output power) SPKVDD = 5.5 V value From: TYP = 2.1 W To: MAX = 2 WGo
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