ZHCSJB4D April   2019  – January 2024 TAS2563

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  I2C Timing Requirements
    7. 5.7  SPI Timing Requirements
    8. 5.8  PDM Port Timing Requirements
    9. 5.9  TDM Port Timing Requirements
    10. 5.10 Timing Diagrams
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PurePath Console 3 Software
      2. 7.3.2  Device Mode and Address Selection
      3. 7.3.3  General I2C Operation
      4. 7.3.4  General SPI Operation
      5. 7.3.5  Single-Byte and Multiple-Byte Transfers
      6. 7.3.6  Single-Byte Write
      7. 7.3.7  Multiple-Byte Write and Incremental Multiple-Byte Write
      8. 7.3.8  Single-Byte Read
      9. 7.3.9  Multiple-Byte Read
      10. 7.3.10 Register Organization
      11. 7.3.11 Operational Modes
        1. 7.3.11.1 Hardware Shutdown
        2. 7.3.11.2 Software Shutdown
        3. 7.3.11.3 Mute
        4. 7.3.11.4 Active
        5. 7.3.11.5 Perform Load Diagnostics
        6. 7.3.11.6 Mode Control and Software Reset
      12. 7.3.12 Faults and Status
      13. 7.3.13 Digital Input Pull Downs
    4. 7.4 Device Functional Modes
      1. 7.4.1 PDM Input
      2. 7.4.2 TDM Port
      3. 7.4.3 Playback Signal Path
        1. 7.4.3.1 Digital Signal Processor
        2. 7.4.3.2 High Pass Filter
        3. 7.4.3.3 Digital Volume Control and Amplifier Output Level
        4. 7.4.3.4 Auto-mute During Idle Channel Mode
        5. 7.4.3.5 Auto-start/stop on Audio Clocks
        6. 7.4.3.6 Supply Tracking Limiters with Brown Out Prevention
        7. 7.4.3.7 Class-D Settings
      4. 7.4.4 SAR ADC
      5. 7.4.5 Boost
      6. 7.4.6 IV Sense
      7. 7.4.7 Load Diagnostics
      8. 7.4.8 Clocks and PLL
      9. 7.4.9 Thermal Foldback
    5. 7.5 Register Maps
      1. 7.5.1  Register Summary Table Page=0x00
      2. 7.5.2  PAGE (page=0x00 address=0x00) [reset=0h]
      3. 7.5.3  SW_RESET (page=0x00 address=0x01) [reset=0h]
      4. 7.5.4  PWR_CTL (page=0x00 address=0x02) [reset=Eh]
      5. 7.5.5  PB_CFG1 (page=0x00 address=0x03) [reset=20h]
      6. 7.5.6  MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
      7. 7.5.7  MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
      8. 7.5.8  TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
      9. 7.5.9  TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
      10. 7.5.10 TDM_CFG2 (page=0x00 address=0x08) [reset=4Ah]
      11. 7.5.11 TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
      12. 7.5.12 TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
      13. 7.5.13 TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
      14. 7.5.14 TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
      15. 7.5.15 TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
      16. 7.5.16 TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
      17. 7.5.17 TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
      18. 7.5.18 TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
      19. 7.5.19 DSP Mode & TDM_DET (page=0x00 address=0x11) [reset=7Fh]
      20. 7.5.20 LIM_CFG0 (page=0x00 address=0x12) [reset=12h]
      21. 7.5.21 LIM_CFG1 (page=0x00 address=0x13) [reset=76h]
      22. 7.5.22 DSP FREQUENCY & BOP_CFG0 (page=0x00 address=0x14) [reset=1h]
      23. 7.5.23 BOP_CFG0 (page=0x00 address=0x15) [reset=2Eh]
      24. 7.5.24 BIL_and_ICLA_CFG0 (page=0x00 address=0x16) [reset=60h]
      25. 7.5.25 BIL_ICLA_CFG1 (page=0x00 address=0x17) [reset=0h]
      26. 7.5.26 GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=0h]
      27. 7.5.27 ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
      28. 7.5.28 INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
      29. 7.5.29 INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
      30. 7.5.30 INT_MASK2 (page=0x00 address=0x1C) [reset=DFh]
      31. 7.5.31 INT_MASK3 (page=0x00 address=0x1D) [reset=FFh]
      32. 7.5.32 INT_LIVE0 (page=0x00 address=0x1F) [reset=0h]
      33. 7.5.33 INT_LIVE1 (page=0x00 address=0x20) [reset=0h]
      34. 7.5.34 INT_LIVE3 (page=0x00 address=0x21) [reset=0h]
      35. 7.5.35 INT_LIVE4 (page=0x00 address=0x22) [reset=0h]
      36. 7.5.36 INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
      37. 7.5.37 INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
      38. 7.5.38 INT_LTCH3 (page=0x00 address=0x26) [reset=0h]
      39. 7.5.39 INT_LTCH4 (page=0x00 address=0x27) [reset=0h]
      40. 7.5.40 VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
      41. 7.5.41 VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
      42. 7.5.42 TEMP (page=0x00 address=0x2C) [reset=0h]
      43. 7.5.43 INT & CLK CFG (page=0x00 address=0x30) [reset=19h]
      44. 7.5.44 DIN_PD (page=0x00 address=0x31) [reset=40h]
      45. 7.5.45 MISC (page=0x00 address=0x32) [reset=80h]
      46. 7.5.46 BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
      47. 7.5.47 BOOST_CFG2 (page=0x00 address=0x34) [reset=4Bh]
      48. 7.5.48 BOOST_CFG3 (page=0x00 address=0x35) [reset=74h]
      49. 7.5.49 MISC (page=0x00 address=0x3B) [reset=58h]
      50. 7.5.50 TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
      51. 7.5.51 BST_ILIM_CFG0 (page=0x00 address=0x40) [reset=36h]
      52. 7.5.52 PDM_CONFIG0 (page=0x00 address=0x41) [reset=1h]
      53. 7.5.53 DIN_PD & PDM_CONFIG3 (page=0x00 address=0x42) [reset=F8h]
      54. 7.5.54 ASI2_CONFIG0 (page=0x00 address=0x43) [reset=8h]
      55. 7.5.55 ASI2_CONFIG1 (page=0x00 address=0x44) [reset=0h]
      56. 7.5.56 ASI2_CONFIG2 (page=0x00 address=0x45) [reset=1h]
      57. 7.5.57 ASI2_CONFIG3 (page=0x00 address=0x46) [reset=FCh]
      58. 7.5.58 PVDD_MSB_DSP (page=0x00 address=0x49) [reset=0h]
      59. 7.5.59 PVDD_LSB_DSP (page=0x00 address=0x4A) [reset=0h]
      60. 7.5.60 REV_ID (page=0x00 address=0x7D) [reset=0h]
      61. 7.5.61 I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
      62. 7.5.62 BOOK (page=0x00 address=0x7F) [reset=0h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Power Supplies
    2. 9.2 Power Supply Sequencing
      1. 9.2.1 Boost Supply Details
      2. 9.2.2 External Boost Mode (Boost Bypass Mode)
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBG|42
  • RPP|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2 Power Supply Sequencing

The power rail may be brought up and down in any order. There is no requirement on sequencing. However if VDD is present without VBAT an additional rise in VDD current will be observed until VBAT is present.

When the supplies have settled, the SDZ terminal can be set HIGH to operate the device. Additionally the SDZ pin can be tied to VDD and the internal POR will perform a reset of the device. After a hardware or software reset additional commands to the device should be delayed for 100 uS to allow the OTP to load. The above sequence should be completed before any I2C operation.
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