The TAS2764 monitors the die temperature and can automatically limit the audio signal when the die temperature reaches a set threshold. It is recommended to use the thermal fold-back registers to configure this protection mechanism as the internal DSP will perform the necessary calculation for each register.

Thermal fold-back can be disabled using TFB_EN register bit. If the die temperature reaches the value set by TF_TEMP_TH[31:0] register bits this feature will begin to attenuate the audio signal to prevent the device from shutting down due to over-temperature. It will attenuate the audio signal by a value set in TF_LIMS[31:0] register bits over a range of temperature set by TF_TEMP_TH[31:0] register bits. The thermal fold-back attack is at a fixed rate of 0.25dB per sample. A maximum attenuation can be specified using register bits TF_MAX_ATTN[31:0]. However, if the device continues to heat up, eventually the device over-temperature will be triggered. The attenuation will be held for a number of samples set by register bits TF_HOLD_CNT[31:0], before the attenuation will begin releasing.